...
首页> 外文期刊>Optical and quantum electronics >Performance optimization of bi-metallic surface plasmon resonance based sensors with silicon layer using poynting vector analysis
【24h】

Performance optimization of bi-metallic surface plasmon resonance based sensors with silicon layer using poynting vector analysis

机译:使用Poyntance vapience分析用硅层的双金属表面等离子体共振基于双金属表面等离子体谐振的性能优化

获取原文
获取原文并翻译 | 示例
           

摘要

We have proposed a formula to calculate the optimum thickness of Silicon (a high-index dielectric) which is introduced in a conventional bi-metallic surface plasmon resonance (SPR) sensor to enhance the sensitivity. This formula has been derived from the penetration depth analysis of the 'instantaneous Poynting vector' in a five-layer bi-metallic sensor structure. This formula is shown to be different from the conventional penetration depth formula of the "average Poynting vector" (intensity) which is discussed in many textbooks on optics. We have applied this formula to optimize the design parameters of a bi-metallic sensor consisting of prism-silver-gold-analyte (H_2O) in Rretschmann configuration with an adjustable Si layer for various combinations of Ag/Au thicknesses to yield maximum sensitivity. The optimum thickness of any high-index dielectric layer which is used in SPR based sensors for the sensitivity enhancement can be calculated from the proposed formula and the values match very well with the experimental results already reported in the literature. Also, the optimum thickness derived using the proposed formula is found to yield the maximum sensitivity of an SPR sensor when computed using the Transfer Matrix Method (TMM) analysis. The analysis of the shape of the SPR curves for the proposed bi-metallic sensor is also done. From the paper, we can conclude that the study of the instantaneous Poynting vector plays an important role in understanding the working of optical devices which are based on the phenomenon of evanescent coupling. The analysis done in this paper can be extended to calculate the design parameters of other evanescently coupled optical devices, such as directional couplers and TE/TM polarizers.
机译:我们提出了一种公式来计算在传统的双金属表面等离子体共振(SPR)传感器中引入的硅(高折射率电介质)的最佳厚度,以增强灵敏度。该公式是从五层双金属传感器结构中的“瞬时Poynting载体”的穿透深度分析来源的。该公式被示出与传统的普形穿透深度公式不同,这些普通Poyntence载体“(强度)在光学上的许多教科书中讨论。我们已经应用了该公式,以优化由RROTSchmann配置中的双金属传感器的设计参数,其具有可调节的Si层,用于各种Ag / Au厚度的组合,以产生最大灵敏度。可以从所提出的公式计算用于灵敏度增强的SPR基传感器的任何高焦点介电层的最佳厚度,并且该值与文献中已经报道的实验结果相匹配。而且,发现使用所提出的公式导出的最佳厚度,以产生使用传递矩阵方法(TMM)分析计算时SPR传感器的最大灵敏度。还完成了所提出的双金属传感器的SPR曲线形状的分析。从本文中,我们可以得出结论,瞬时Poynting载体的研究在理解基于渐逝耦合现象的光学器件的工作方面起着重要作用。在本文中完成的分析可以扩展以计算其他流向耦合光学装置的设计参数,例如定向耦合器和TE / TM偏振器。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号