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Directional nickel silicide-induced crystallization of amorphous silicon channel under high-density current stressing

机译:高密度电流应力下定向硅化镍诱导非晶硅沟道的晶化

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The effects of electric field and doping species on directional crystallization of a-Si channels under high-density cur to a dose of rent stressing have been investigated. The a-Si channels were implanted by 30 keV BF2+ or As+ 3 x 10(15) ions/cm(2). A preferential growth of poly-Si from anode toward cathode was found on BF2+, As+ and unimplanted a-Si samples. The results indicate that directional growth of poly-Si is caused by the strong electric field effect on positively charged Ni ions under high-density current stressing. (c) 2005 Elsevier B.V. All rights reserved.
机译:研究了电场和掺杂种类对高密度固化至一定应力强度下a-Si沟道定向结晶的影响。用30 keV BF2 +或As + 3 x 10(15)离子/ cm(2)注入a-Si通道。在BF2 +,As +和未注入的a-Si样品上发现了从阳极到阴极的多晶硅优先生长。结果表明,多晶硅的定向生长是由于在高密度电流应力下强电场作用于带正电的Ni离子所致。 (c)2005 Elsevier B.V.保留所有权利。

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