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Quantitative characterization of xenon bubbles in silicon: Correlation of bubble size with the damage generated during implantation

机译:硅中氙气气泡的定量表征:气泡尺寸与注入过程中产生的损伤的相关性

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Making use of Fresnel fringe contrast under different focusing conditions in transmission electron microscopy (TEM), we present a detailed evaluation of the depth dependent size distribution of gas bubbles contained in a stationary profile of 40 keV Xe implanted in Si. Voids generated during sample preparation by ion milling were also characterized carefully. The largest bubbles, with mean and maximum sizes of 5 and 7 nm, respectively, were observed at depths <22 nm. However, the first 2 nm of the sample did not contain any bubbles. Towards the end of range the bubble size decreased rapidly. No bubbles were found beyond 45 nm (the minimum size of detectable bubbles was estimated to be about 1.8 nm). Some observations suggest that the bubbles were over-pressurized. The derived data could be converted to a depth dependence of the Xe concentration contained in bubbles, n_(Xe.b) Comparison with the previously reported depth distribution of Xe measured by Rutherford backscattering spectrometry (RBS), n_(Xe.b) turned out to be depth dependent, with a maximum of ~28% in the region of maximum bubble size. n_(Xe.b) is shown to correlate closely with the damage density generated during Xe implantation. The findings lead to a model of bubble formation which involves the idea that the redistribution and transport processes initiated by ion impact take place mostly during the lifetime of the collision cascade.
机译:利用透射电子显微镜(TEM)中不同聚焦条件下的菲涅耳条纹对比度,我们对植入在Si中的40 keV Xe固定轮廓中包含的气泡的深度依赖性尺寸分布进行了详细评估。还仔细表征了通过离子铣削在样品制备过程中产生的空隙。在<22 nm的深度处观察到最大气泡,平均气泡的大小为5 nm,最大气泡的大小为7 nm。但是,样品的前2 nm不包含任何气泡。接近范围的末端,气泡尺寸迅速减小。在45 nm以上未发现气泡(可检测到的气泡的最小尺寸估计约为1.8 nm)。一些观察结果表明气泡过高。可以将导出的数据转换为气泡中Xe浓度的深度依赖性,n_(Xe.b)与先前报道的通过卢瑟福背散射光谱法(RBS)测量的Xe深度分布进行比较,结果n_(Xe.b)取决于深度,在最大气泡尺寸范围内最大〜28%。显示n_(Xe.b)与Xe植入过程中产生的损伤密度密切相关。这些发现导致了一个气泡形成模型,该模型涉及这样一个想法,即由离子碰撞引发的重新分布和传输过程主要发生在碰撞级联的整个寿命期间。

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