机译:反应性Ar / CF_4大功率脉冲磁控溅射等离子体对类金刚石碳膜的表面处理
Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555, Japan;
Graduate School of Engineering, Nagoya Institute of Technology, Gokiso-cho, Showa-ku, Nagoya 466-8555, Japan;
Department of Electrical Engineering and Computer Sciences, University of Hyogo, 2167 Shosha, Himeji, Hyogo 671-2280, Japan;
National Institute of Advanced Industrial Science and Technology (AIST) - Chubu, 2266-98 Anagahora, Moriyama, Nagoya 463-8560, Japan;
National Institute of Advanced Industrial Science and Technology (AIST) - Chubu, 2266-98 Anagahora, Moriyama, Nagoya 463-8560, Japan;
National Institute of Advanced Industrial Science and Technology (AIST) - Chubu, 2266-98 Anagahora, Moriyama, Nagoya 463-8560, Japan;
National Institute of Advanced Industrial Science and Technology (AIST) - Chubu, 2266-98 Anagahora, Moriyama, Nagoya 463-8560, Japan;
Surface treatment; High-power pulsed magnetron sputtering; Reactive plasma; CF_4 mixture; Amorphous fluorinated carbons;
机译:反应性Ar / CH_4大功率脉冲磁控溅射形成类金刚石氢化碳膜
机译:反应大功率脉冲磁控溅射与基于等离子体的离子注入系统相结合的具有电导率的硅掺杂金刚石状碳膜的制备
机译:使用带负脉冲电压源的反应性Ar / CH4大功率脉冲磁控溅射系统制备类金刚石碳膜
机译:通过O_2 / CF_4血浆治疗改善金刚石碳膜亲水稳定性
机译:脉冲直流反应磁控管溅射氮化铝薄膜。
机译:大功率脉冲磁控溅射镍薄膜的斜角沉积
机译:基底离子磁通与AR和AR +鼻等离子体深振荡磁控溅射沉积的金刚石状碳膜的性质的相关性