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Readout electronics for X-ray imaging using gas-filled detectors

机译:使用充气探测器的X射线成像读出电子设备

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The paper describes a comprehensive readout electronics system for X-ray imaging using gas-filled detectors to be used at the European Synchrotron Radiation Facility (ESRF). The front-end electronics (named BLADE3) relies on a multi-strips binary parallel readout architecture. BLADE3 features 256 channels in a small space (120 × 300 mm~2 printed circuit board) at low power (12 mW per channel for the analog processing). It is based on a 16-channel preamplifier-discriminator ASIC (named ASG217) of the trans-impedance type. The ASG217 measured gain (220 kΩ), peaking time (15ns), and RMS noise (1.5mV + 0.1 mV/pF) well match the simulated results. Front-end boards communicate with the back-end electronics using 2 Gb/s optical links. The back-end electronics has been implemented in the CompactPCI format and can be operated through a PCI bridge by any host computer. The experience gained with a prototype detector indicates that the front-end electronics meets our requirements. The back-end electronics, already operational for one-dimensional readout, has to be significantly improved for supporting two-dimensional imaging at high photon flux.
机译:该论文描述了一种使用气体检测器的X射线成像综合读取电子系统,该系统将在欧洲同步辐射装置(ESRF)上使用。前端电子设备(名为BLADE3)依赖于多条二进制并行读取体系结构。 BLADE3在较小的空间(120×300 mm〜2印刷电路板)中以低功耗(每通道12 mW用于模拟处理)具有256个通道。它基于跨阻抗类型的16通道前置放大器-鉴别器ASIC(名称为ASG217)。 ASG217测得的增益(220kΩ),峰值时间(15ns)和RMS噪声(1.5mV + 0.1 mV / pF)与仿真结果完全匹配。前端板使用2 Gb / s光学链路与后端电子设备进行通信。后端电子设备已以CompactPCI格式实现,并且可以由任何主机通过PCI桥接器进行操作。使用原型检测器获得的经验表明,前端电子设备符合我们的要求。为了支持高光子通量的二维成像,已经进行了一维读出的后端电子设备必须进行显着改进。

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