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Logic Gates Made Of N-channel Jfets And Epitaxial Resistors:gates Could Be Implemented In Sic Ics For Operation At High Temperatures

机译:由N沟道Jfet和外延电阻制成的逻辑门:可以在Sic IC中实现门以在高温下运行

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摘要

Prototype logic gates made of n-chan-nel junction field-effect transistors (JFETs) and epitaxial resistors have been demonstrated, with a view toward eventual implementation of digital logic devices and systems in silicon carbide (SiC) integrated circuits (ICs). This development is intended to exploit the inherent ability of SiC electronic devices to function at temperatures from 300 to somewhat above 500 ℃ and withstand large doses of ionizing radiation. SiC-based digital logic devices and systems could enable operation of sensors and robots in nuclear reactors, in jet engines, near hydrother-mal vents, and in other environments that are so hot or radioactive as to cause conventional silicon electronic devices to fail. At present, current needs for digital processing at high temperatures exceed SiC integrated circuit production capabilities, which do not allow for highly integrated circuits. Only single to small number component production of depletion mode n-channel JFETs and epitaxial resistors on a single substrate is possible. As a consequence, the fine matching of components is impossible, resulting in rather large direct-current parameter distributions within a group of transistors typically spanning multiples of 5 to 10. Add to this the lack of p-channel devices to complement the n-channel FETs, the lack of precise dropping diodes, and the lack of enhancement mode devices at these elevated temperatures and the use of conventional direct coupled and buffered direct coupled logic gate design techniques is impossible.
机译:为了最终在碳化硅(SiC)集成电路(IC)中实现数字逻辑器件和系统,已展示了由n沟道结型场效应晶体管(JFET)和外延电阻器制成的原型逻辑门。这项开发旨在利用SiC电子器件在300至500℃以上的温度下工作并承受大剂量电离辐射的固有能力。基于SiC的数字逻辑设备和系统可以使传感器和机器人在核反应堆,喷气发动机,水热通风口附近以及在其他高温或高放射性的环境中运行,从而导致常规的硅电子设备发生故障。目前,当前高温下数字处理的需求超过了SiC集成电路的生产能力,这无法实现高度集成电路。只能在单个基板上生产耗尽型n沟道JFET和外延电阻的单个到少量组件。结果,不可能进行元件的精确匹配,从而导致通常在5到10的倍数范围内的一组晶体管中存在相当大的直流参数分布。此外,缺少p沟道器件来补充n沟道FET,缺少精确的降压二极管以及在这些高温下缺少增强模式器件以及使用常规直接耦合和缓冲直接耦合逻辑门设计技术都是不可能的。

著录项

  • 来源
    《NASA Tech Briefs》 |2008年第12期|p.28|共1页
  • 作者

    John H. Glenn;

  • 作者单位

    Research Center, Cleveland, Ohio;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 航空;
  • 关键词

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