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Hard and soft magnetic materials for electromagnetic microactuators

机译:电磁微执行器的硬磁和软磁材料

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An important aspect of the development of electromagnetic microactuators is the search for suitable materials as well as the development of the respective deposition and patterning processes. Within the Collaborative Research Center 516 “Design and Fabrication of Active Microsystems”, it is the task of the subproject B1 “fabrication of magnetic thin films for electromagnetic microactuators” to perform these investigations. The materials of interest can be divided into two groups: hard magnetic materials and soft magnetic materials. Materials with optimized properties and fabrication processes have been developed within both groups. An example is Samarium–Cobalt (SmCo), which can either be deposited using magnetron sputtering as Sm2Co17 with a very high energy product or in the SmCo5 phase using gas flow sputtering with very high deposition rates. In the area of soft magnetic materials, investigations on Nickel-Iron (NiFe) especially NiFe81/19 were followed by the evaluation of NiFe45/55, which features a higher saturation flux density B s and relative permeability μ r. Furthermore, current investigations focus on Cobalt-Iron (CoFe) and its further increased saturation flux density B s and relative permeability μ r. Current tasks include the stabilization of the fabrication processes to achieve good material properties (i.e. electroplating of CoFe) or a shortening (e.g. by using heated substrates during deposition) by using process alternative not used so far. Another topic is the integration into fabrication processes, i.e. the investigation of process stability and compatibility.
机译:电磁微致动器的发展的重要方面是寻找合适的材料以及相应的沉积和构图工艺的发展。在协作研究中心516“有源微系统的设计和制造”中,子项目B1“为电磁微致动器制造磁性薄膜”的任务是进行这些研究。感兴趣的材料可以分为两组:硬磁材料和软磁材料。两组中均已开发出具有优化性能和制造工艺的材料。 mar钴(SmCo)就是一个例子,既可以使用磁控溅射法以非常高的能量产物作为Sm2 Co17 进行沉积,也可以使用具有非常高能量积的气流溅射在SmCo5 相中进行沉积。高沉积速率。在软磁材料领域,对镍铁(NiFe)尤其是NiFe81 / 19进行了研究,随后进行了NiFe45 / 55评估,该方法具有较高的饱和磁通密度B s 和相对磁导率μr 。此外,目前的研究集中在钴铁(CoFe)及其进一步提高的饱和磁通密度B s 和相对磁导率μr 上。当前的任务包括通过使用到目前为止尚未使用的工艺替代方法来稳定制造工艺,以实现良好的材料性能(即,CoFe的电镀)或缩短工艺(例如,通过在沉积过程中使用加热的基材)。另一个主题是集成到制造过程中,即研究过程的稳定性和兼容性。

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  • 来源
    《Microsystem Technologies》 |2008年第12期|1949-1954|共6页
  • 作者单位

    Institute for Microtechnology Leibniz Universitaet Hannover Hannover Germany;

    Fraunhofer-Institute for Surface Engineering and Thin Films Brunswick Germany;

    Fraunhofer-Institute for Surface Engineering and Thin Films Brunswick Germany;

    Fraunhofer-Institute for Surface Engineering and Thin Films Brunswick Germany;

    Institute for Microtechnology Leibniz Universitaet Hannover Hannover Germany;

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