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TERAFLUX: Harnessing dataflow in next generation teradevices

机译:TERAFLUX:利用下一代TeraDevices中的数据流

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The improvements in semiconductor technologies are gradually enabling extreme-scale systems such as teradevices (i.e., chips composed by 1000 billion of transistors), most likely by 2020. Three major challenges have been identified: programmability, manageable architecture design, and reliability. TERAFLUX is a Future and Emerging Technology (FET) large-scale project funded by the European Union, which addresses such challenges at once by leveraging the dataflow principles. This paper presents an overview of the research carried out by the TERAFLUX partners and some preliminary results. Our platform comprises 1000+ general purpose cores per chip in order to properly explore the above challenges. An architectural template has been proposed and applications have been ported to the platform. Programming models, compilation tools, and reliability techniques have been developed. The evaluation is carried out by leveraging on modifications of the HP-Labs COTSon simulator.
机译:半导体技术的进步正在逐步实现诸如teradevices(即由1万亿个晶体管组成的芯片)之类的超大规模系统,最有可能在2020年实现。已经确定了三个主要挑战:可编程性,可管理的体系结构设计和可靠性。 TERAFLUX是由欧盟资助的未来和新兴技术(FET)大型项目,它利用数据流原理立即解决了这些挑战。本文概述了TERAFLUX合作伙伴进行的研究,并得出了一些初步结果。我们的平台每个芯片包含1000多个通用内核,以正确应对上述挑战。已经提出了一种架构模板,并将应用程序移植到了平台上。已经开发出编程模型,编译工具和可靠性技术。通过利用HP-Labs COTSon模拟器的修改来进行评估。

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