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Local lifetime control IGBT structures f turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs

机译:本地寿命控制IGBT结构在1200V沟槽与新型平面PT-IGBT之间进行硬和软切换时的关断性能比较

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More expensive than the gold/Platinum diffusion and the electron irradiation processes, the local lifetime control process using proton irradiation allows improving relatively well the devices performances. Applied to IGBTs, this process can minimize the magnitude of the current tail during turn-off when the temperature increases. The goal of the local lifetime control is to minimize the rise of the gain of the PNP bipolar transistor as well as the rise of the minority carrier lifetime. To evaluate the efficiency of that process, the following study presents a comparative analysis of turn-off switching performances for hard- and soft-switching at high temperature of 1200V new types of IGBT. In order to give an overview of the local lifetime control process effect, both trench and new planar IGBTs performances have been investigated at high temperature and compared to conventional planar IGBT using global lifetime control. Current and voltage waveforms and turn-off switching losses are analyzed. Results show that the local lifetime control process is very efficient under hard-switching and zero-voltage switching, but this is not the case under zero-current switching, especially for the new planar IGBT.
机译:比金/铂扩散和电子辐照过程更昂贵,使用质子辐照的局部寿命控制过程可以相对好地改善器件性能。应用于IGBT时,此过程可以在温度升高时在关断期间将电流尾部的大小最小化。局部寿命控制的目标是最小化PNP双极晶体管增益的增加以及少数载流子寿命的增加。为了评估该过程的效率,以下研究对1200V新型IGBT在高温下的硬开关和软开关的关断开关性能进行了比较分析。为了概述局部寿命控制过程的影响,已经在高温下研究了沟槽和新型平面IGBT的性能,并与使用全局寿命控制的常规平面IGBT进行了比较。分析了电流和电压波形以及关断开关损耗。结果表明,在硬开关和零电压开关下,本地寿命控制过程非常有效,但在零电流开关下却不是这种情况,尤其是对于新型平面IGBT。

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