机译:尺寸和约束对微尺度焊料互连的界面断裂行为的影响
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China;
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China;
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China;
School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China;
Electronks Engineering, City University of Hong Kong, and CALCE Electronic Products &Systems Center, University of Maryland, MD 20742-9121, USA;
机译:界面金属间质量对SN3.0AG0.5CU焊料互连骨折韧性的微观结构和尺寸效应
机译:尺寸和约束条件对微型Ni / Sn3.0Ag0.5Cu / Ni焊点力学和断裂行为的影响
机译:焊料量对Sn-3.0Ag-0.5Cu球栅阵列结构的微结构演变和剪切断裂行为的影响
机译:微型Sn-Ag-Cu焊料互连界面的界面断裂和冲击行为的有限元模拟
机译:微观结构对TinSilverCopper焊料的本构和疲劳断裂行为的影响。
机译:Sn-xAg-yCu焊料与Cu基体界面反应动力学的尺寸效应模型
机译:由Fe-3质量%Si合金单晶和样品尺寸效应制备微型样品的断裂行为
机译:尺寸和体积分数对复合材料断裂行为的影响。