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Borderless silicon nitride defect behaviour and their influences on initial data loss in single polysilicon flash memories

机译:无边界氮化硅缺陷行为及其对单个多晶硅闪存中初始数据丢失的影响

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摘要

Pre Metal Dielectric layer characterization by capacitance versus voltage hysteresis method has revealed the larger charge amount contained in the PECVD borderless silicon nitride. Its charges, attributed to K centers, exist under two states K~+ and K~- that can be cycled thanks to carrier injection or by direct transformation under thermal activation. Thus, this dielectric presents a memory like behaviour. Based on detailed characterization of charge exchange in this dielectric, a fast initial charge loss model is proposed in order to explain the fast charge losses observed during programming and erasing bake sequences on single polysilicon flash memories.
机译:通过电容对电压迟滞方法的金属前电介质层表征表明,PECVD无边界氮化硅中包含较大的电荷量。它的电荷归因于K中心,处于K〜+和K〜-两种状态,由于载流子注入或在热激活下通过直接转化而可以循环。因此,该电介质呈现出类似行为的记忆。基于该电介质中电荷交换的详细特征,提出了一种快速的初始电荷损耗模型,以解释在编程和擦除单个多晶硅闪存上的烘烤序列期间观察到的快速电荷损耗。

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