首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Contact Etch Stop A-si_xn_y:h Layer: A Key Factor For Single Polysilicon Flash Memory Data Retention
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Contact Etch Stop A-si_xn_y:h Layer: A Key Factor For Single Polysilicon Flash Memory Data Retention

机译:接触蚀刻停止层A-si_xn_y:h层:单个多晶硅闪存数据保留的关键因素

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摘要

The silicon nitride (α-Si_xN_y: H) contact etch stop layer strongly affects data retention performances in single polysilicon nonvolatile memories by acting on the initial charge loss phenomenon. Its improvement has required an analysis of influent plasma enhanced chemical vapor deposition process parameters through a design of experiment approach. The α-Si_xN_y: H physico-electrical analysis points out that silicon rich compositions especially of its interfacial layer must be avoided to reduce α-Si_xN_y: H charge amount and as a result to improve the data retention. Indeed, the α-Si_xN_y: H being near the floating gate, its charges modulation could act as a parasitic memory screening charges stored in the floating gate by capacitive effects.
机译:氮化硅(α-Si_xN_y:H)接触蚀刻停止层通过作用于初始电荷损失现象,强烈影响单个多晶硅非易失性存储器中的数据保留性能。它的改进要求通过设计实验方法来分析进水等离子体增强的化学气相沉积工艺参数。 α-Si_xN_y:H物理电分析指出,必须避免富含硅的成分,尤其是其界面层的富硅成分,以减少α-Si_xN_y:H的电荷量,从而提高数据保留率。实际上,α-Si_xN_y:H在浮栅附近,其电荷调制可以充当寄生存储器,以通过电容效应屏蔽存储在浮栅中的电荷。

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