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机译:一种新颖的芯片到晶片(C2W)三维(3D)集成方法,使用模板进行精确对准
Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA,Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;
Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;
Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;
Tezzaron Semiconductor Corporation, Naperville, IL 60563, USA;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, China;
Department of Electrical, Computer and Systems Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, USA;
chip-to-wafer (C2W); three-dimensional (3D) integration; precise alignment; BCB template; Cu-Cu bonding;
机译:利用芯片对晶圆键合实现最终超级芯片集成的新型三维集成技术
机译:芯片对晶圆三维集成薄硅片中局部弯曲应力对互补金属氧化物半导体特性影响的研究
机译:一种幻影研究,评估3D / 3D,2D / 3D和3D表面匹配的三种不同登记平台,与6D对准进行精确的图像引导放射疗法
机译:一种新颖的芯片到晶片(C2W)三维(3D)集成方法,使用模板进行精确对准
机译:通过低温芯片对晶圆键合将铟镓砷MSM阵列与硅平台进行3D集成。
机译:GRAFENE:基于Graphlet的免比对网络方法整合了3D结构和序列(残基顺序)数据以改善蛋白质结构比较
机译:用于3D集成中芯片到晶圆对准的苯并环丁烯(BCB)模板的设计和验证
机译:利用三维电子显微镜获得细胞断层图像三维分割的新方法