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Electrical characterization of n-channel MOSFETs with oxynitride gate dielectric formed by Low-Pressure Rapid Thermal Chemical Vapor Deposition

机译:低压快速热化学气相沉积形成的具有氮氧化物栅极电介质的n沟道MOSFET的电学特性

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This study reports on n-channel MOS transistors using very thin oxynitride gate dielectrics deposited by Low-Pressure Rapid Thermal Chemical Vapor Deposition (LPRTCVD). The threshold voltage, the transconductance, the fast and slow trap densities, the low field mobility and its reduction factors have been investigated as a function of the nitrogen concentration in the film. The threshold voltage was found to decrease linearly with the nitrogen concentration, primarily because of the increase of the positive insulator charge density. At the same time, it has been shown that the quadratic mobility reduction factor is lower for a LPRTCVD oxynitride (and nearly constant with the nitrogen concentration) in comparison to a thermal oxide. From this high field mobility attenuation, a lower transconductance is then expected for oxynitride-based transistors. Finally, we have shown that the presence of nitrogen in the oxide seems to induce more donor than acceptor traps at the oxynitride-silicon interface.
机译:这项研究报告了使用低压快速热化学气相沉积(LPRTCVD)沉积的非常薄的氮氧化物栅极电介质的n沟道MOS晶体管。已经研究了阈值电压,跨导,快和慢的陷阱密度,低场迁移率及其降低因子与膜中氮浓度的关系。发现阈值电压随氮浓度线性降低,这主要是由于正绝缘体电荷密度的增加。同时,已经表明,与热氧化物相比,LPRTCVD氧氮化物的二次迁移率降低因子更低(并且对于氮浓度几乎恒定)。由于这种高的场迁移率衰减,对于基于氧氮化物的晶体管,可以期望更低的跨导。最后,我们证明了在氧化物中氮的存在似乎比在氮氧化物-硅界面处的受主陷阱诱使更多的施主。

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