机译:基于PI的3D堆叠式高
Inst. of Microelectron., Peking Univ., Beijing, China;
Q-factor; biomedical electrodes; inductive power transmission; inductors; microelectrodes; micromechanical devices; polymers; prosthetics; radiofrequency power transmission; 3D double layer stacked structure; 3D stacked high-Q PI-based MEMS inductor; bioimplanted applications; frequency 1.6 MHz; high-Q factor 3D stacked MEMS inductors; implanted 3D microelectrode array; implanted medical devices; inductively coupled wireless power transmission system; load impedance; neural prosthesis; peak-to-peak output open circuit voltage; polyimide substrate; power 35.5 mW; self-planarization; solenoid transmitting coil; transmission distance; Coils; Copper; Inductance; Inductors; Magnetic cores; Micromechanical devices; Three-dimensional displays; MEMS inductor; Quality factor; bio-implanted; electrodeposition; wireless power transmission; wireless power transmission.;
机译:高
机译:新型高
机译:单片IPD-MEMS技术及其在高
机译:用于3D堆叠式封装的无线电力传输系统的多螺旋电感器
机译:无线功率传输系统在无线胶囊内窥镜中的应用:概述
机译:混合