QFN (Quad Flat Non-Leaded Package)

摘要

In the recent trend of miniaturizaton of electronic equipment such as cellular mobile telephones and pagers, further miniaturization of their components is being promoted. The P-VQFN package has been developed with a target of small pin area with less than 100 terminal pins. This paper introduces the new process technology in the P-VQFN development, mainly for preventing thin burrs on the terminal faces and for increasing the terminal attaching strength. Also described is the reliability evaluation in the condition of P-VQFN mounted on printed circuit board.