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Design and characterization of a novel dual-gate 3.3 kV 4H-SiC JFET

机译:新型双栅3.3 kV 4H-SiC JFET的设计与表征

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摘要

This paper presents the methodology for the design of a novel 4H-SiC JFET structure able to sustain 3.3 kV. Comparisons between simulation and characterization res will be made. Taken into account the process limitation, we will also discuss the critical steps and their impact on the electrical characteristics. A design methodology based on Baliga's criterion is proposed to obtain the optimal structure. A 50 nm thick thermal oxide grown above vertical channel and the use of a buried p~+ layer as second gate electrode are brand new in front of what is found in literature.
机译:本文介绍了一种能够承受3.3 kV电压的新型4H-SiC JFET结构的设计方法。将进行仿真和特性分析之间的比较。考虑到工艺限制,我们还将讨论关键步骤及其对电气特性的影响。提出了一种基于Baliga准则的设计方法,以获得最优结构。在文献发现之前,在垂直沟道上方生长的50 nm厚的热氧化物以及使用掩埋的p〜+层作为第二栅电极是全新的。

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