...
首页> 外文期刊>Materials Science and Engineering >Effect of Alloying Interlayer on Interfacial Bond Strength of CuW/CuCr Integral Materials
【24h】

Effect of Alloying Interlayer on Interfacial Bond Strength of CuW/CuCr Integral Materials

机译:合金夹层对CuW / CuCr整体材料界面结合强度的影响

获取原文
获取原文并翻译 | 示例

摘要

The effects of Fe alloying interlayers with different content on microstructures and mechanical properties of dissimilar CuW/CuCr joints prepared by sintering-infiltration method were studied. Microhardness (HV) and tensile tests were used to evaluate the mechanical properties of the resulting joints. Additionally, optical, scanning electron microscopy examinations and energy dispersive spectrometry elemental analyses were applied to determine the interfacial characteristics of CuW/CuCr integral materials. The results show element Fe in the alloying interlayers is mostly diffused to the Cu-W composite side, the Cu/W interphase has achieved the metallurgical bond, and the CuW/CuCr integrated material with Cu-5wt%Fe alloy interlayer exhibits higher interfacial bond strength. However, when the Fe content in the interlayers is above 5wt%, the W skeletons near the interface are dissolved and eroded by element Fe addition, the amount of eutectic phase is increased and the microhardness on copper matrix is decreased for the Cu-Cr alloy side near the interlayer, and the interfacial strength of CuW/CuCr integrated materials is also decreased.
机译:研究了不同含量的Fe合金中间层对烧结-渗入法制备的不同CuW / CuCr接头组织和力学性能的影响。显微硬度(HV)和拉伸试验用于评估所得接头的机械性能。另外,应用光学,扫描电子显微镜检查和能量色散光谱元素分析来确定CuW / CuCr整体材料的界面特性。结果表明,合金中间层中的Fe主要扩散到Cu-W复合物侧,Cu / W中间相实现了冶金结合,Cu-5wt%Fe合金中间层的CuW / CuCr集成材料表现出较高的界面结合强度。然而,当中间层中的Fe含量超过5wt%时,界面处的W骨架会因元素Fe的添加而溶解和腐蚀,共晶相的数量增加,而Cu-Cr合金的铜基显微硬度降低。另外,CuW / CuCr一体材料的界面强度也降低。

著录项

  • 来源
    《Materials Science and Engineering 》 |2010年第22期| P.5631-5636| 共6页
  • 作者单位

    Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University ofTechnology, Xi'an, 710048, China;

    Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University ofTechnology, Xi'an, 710048, China;

    Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University ofTechnology, Xi'an, 710048, China School of Materials Science and Technology, Xi'an University of Technology, Jinhua road 5, Xi'an, China;

    Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University ofTechnology, Xi'an, 710048, China;

    Shaanxi Key Laboratory for Electrical Materials and Infiltration Technology, School of Materials Science and Engineering, Xi'an University of Technology, Xi'an, 710048, China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    CuW/CuCr dissimilar material; interfacial bond strength; alloying interlayer; interfacial microstructure; microhardness;

    机译:CuW / CuCr异种材料;界面粘结强度;合金夹层界面微观结构显微硬度;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号