A Model for Predicating the Interfacial Bond Strength of Integral CuW/CuCr Materials

摘要

A theoretical model for predicating interfacial bond strength of CuW/CuCr integral materials was developed on the basis of the geometric computational model of Cu-W alloy addressed by R.M.German. For validating the practicability of this theoretical computational model, a series of CuW/Cu0.8wt%Cr integral materials with different W contents were prepared by the sintering-infiltration technique. The interfacial bond strength of these integral materials were measured after solution-aging treatment. The reasons that theoretical strength are different from the experimental values were investigated and the corresponding strength computational formula was modified considering the factors affected the interfacial tensile strength. According to this model, the interfacial strength of CuW/CuCr integral materials with different W contents were predicated through calculating the area fraction of Cu phase of scanning electron microscopy (SEM) images of Cu-W alloys. The predicated values are in good agreement with the theoretical calculating strength, and this model provides an upper limit of the interfacial strength of CuW/CuCr integral material with any given composition. So effects of interfacial compositions and microstructures on bond strength of CuW/CuCr dissimilar materials can be assessed by this ideal modle, prior to launching into expensive experimentation. And on assessing microstructures of Cu-W composites, the interfacial bond strength of CuW/CuCr integral materials can be predicated effectively by applying this interfacial strength model.