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Microstructural mechanism and mechanical properties of C_f/SiC composite/ TC4 alloy joints composite-diffusion brazed with TiZrCuNi + TiC_p composite filler

机译:TiZrCuNi + TiC_p复合填料钎焊后的C_f / SiC复合材料/ TC4合金接头扩散扩散的组织结构和力学性能

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in this paper, C-f/SiC composites and TC4 alloys were joined by the novel composite-diffusion brazing process using (Ti-Zr-Cu-Ni) + TiCp composite filler. The microstructural behavior and mechanism of the joints was deeply investigated by SEM, TEM and XRD. Mechanical properties versus different process parameters of the joints were thoroughly discussed. It was discovered that a reaction-breaking phenomenon occurred for TiC particles. During the bonding process, Zr atoms concentrated around TiC particles and reacted with them to form Ti(Zr)C compound layer on the surface of TiCp . As the reactions progressed, the Ti(Zr)C layer split into fine particles from TiC and then distributed uniformly in the joining layer together with the residual TiC particles. The smaller the TiC particle was, the less time it took to complete the breaking and dispersion process. These low coefficient thermal expansion (CTE) particles were beneficial for releasing the joint residual stress and significantly improved the mechanical properties of the joints. The shear strength of the joints at room temperature (RT) showed a peak value as the bonding temperature was raised or the holding time was prolonged when the TiCp content kept constant. With the increase of TiCp content, the bonding temperature corresponding to the peak shear strength of the joints became higher, the holding time corresponding to peak shear strength of the joints became longer. The shear strength of the joints at 800 degrees C had similar variation trend with the changing of bonding temperature, holding time and the content of TiCp . But, compared with the RT shear strength, the shear strength of joints at 800 degrees C was much smaller and the peak shear strength corresponded to longer holding time. The maximum shear strength of the joints at room temperature and 800 degrees C were 224 MPa and 157 MPa respectively.
机译:在本文中,使用(Ti-Zr-Cu-Ni)+ TiCp复合填料通过新颖的复合扩散钎焊工艺将C-f / SiC复合材料和TC4合金连接起来。通过SEM,TEM和XRD对接头的微观组织行为和机理进行了深入研究。全面讨论了接头的机械性能与不同工艺参数之间的关系。发现TiC颗粒发生反应破裂现象。在键合过程中,Zr原子集中在TiC颗粒周围并与之反应,从而在TiCp的表面上形成Ti(Zr)C化合物层。随着反应的进行,Ti(Zr)C层从TiC分裂成细颗粒,然后与残留的TiC颗粒一起均匀地分布在连接层中。 TiC颗粒越小,完成破碎和分散过程所需的时间就越少。这些低系数热膨胀(CTE)粒子有利于释放接头残余应力并显着改善接头的机械性能。当TiCp含量保持恒定时,接合点在室温(RT)处的剪切强度随粘结温度的升高或保持时间的延长而出现峰值。随着TiCp含量的增加,与接头峰值剪切强度相对应的结合温度变高,与接头峰值剪切强度相对应的保持时间变长。 800°C时接头的剪切强度随着粘结温度,保温时间和TiCp含量的变化而具有相似的变化趋势。但是,与RT剪切强度相比,在800摄氏度时接头的剪切强度要小得多,峰值剪切强度对应于更长的保持时间。在室温和800摄氏度下,接头的最大剪切强度分别为224 MPa和157 MPa。

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