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首页> 外文期刊>Materials Characterization >Microstructural evolution and mechanical properties of the joint of TiAl alloys and C/SiC composites vacuum brazed with Ag-Gu filler metal
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Microstructural evolution and mechanical properties of the joint of TiAl alloys and C/SiC composites vacuum brazed with Ag-Gu filler metal

机译:Ag-Gu填充金属真空钎焊TiAl合金与C / SiC复合材料接头的组织演变和力学性能

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摘要

Microstructural evolution and shear strength of vacuum brazed TiAl alloys to C/SiC composites using Ag-Cu filler metal were investigated. The dissolution of active elements Ti and Al from TiAl substrate has a strong influence on the microstructure and shear strength of the joint. Ag is the less active element of the filler and Cu has strong tendency to the formation of AlCu_2Ti phase with the dissolved Ti and Al. Ag-Cu eutectic is gradually taken place by AlCu_2Ti blocks and Ag-based solid solution with the increase of brazing temperature or time. The TiC reaction layer including a small amount of Ti_5Si_3 phase is formed adjacent to C/SiC composites when active element Ti diffused into C/SiC composite and chemical reaction occurred in the composite interface. The shear strength of the joint depends heavily on the thickness of the TiC reaction layer. The maximum shear strength achieved 85 MPa for the joint vacuum brazed at 900 °C for 10 min. Cracks primarily propagate along Ag-rich phase and TiC layer. The TiC layer with the thickness of 4-5 nm is formed at the boundary of SiC matrix.
机译:研究了使用Ag-Cu填充金属的真空钎焊TiAl合金对C / SiC复合材料的组织演变和剪切强度。活性元素Ti和Al从TiAl基体中的溶解对接头的微观结构和剪切强度有很大影响。 Ag是填充剂中活性较低的元素,Cu倾向于与溶解的Ti和Al形成AlCu_2Ti相。随着钎焊温度或时间的增加,Al-Cu_2Ti嵌段和Ag基固溶体逐渐发生Ag-Cu共晶。当活性元素Ti扩散到C / SiC复合物中并且在复合界面中发生化学反应时,邻近C / SiC复合物形成包含少量Ti_5Si_3相的TiC反应层。接头的剪切强度在很大程度上取决于TiC反应层的厚度。对于在900°C下钎焊10分钟的接头真空连接,最大剪切强度达到85 MPa。裂纹主要沿着富银相和TiC层传播。在SiC基体的边界处形成厚度为4-5nm的TiC层。

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