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PHASE TRANSFORMATION AND MORPHOLOGICAL EVOLUTION OF ION-BEAM SPUTTERED TIN OXIDE FILMS ON SILICON SUBSTRATE

机译:硅衬底上离子束溅射二氧化锡薄膜的相变和形貌演化

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Amorphous tin oxide films were deposited on a silicon substrate by ion-beam sputtering (IBS) using a SnO_2 target. Phase transformation and morphological changes of deposited films at different annealing temperatures were studied by X-ray diffraction and scanning electron microscopy. Crystallization of the as-deposited film started at 350deg.C and SnO and SnO_2 phases formed at 400deg.C. Disproportionation of SnO into Sn and SnO_2 was observed at 450den.C followed by the oxidation of metallic tin at 550deg.C. Large volume changes accompa- nying the oxidation of metallic tin at this temperature caused the partial detachment and formation of heavy wrinkles on the film. These results suggest that the oxygen deficiency of tin oxide films should be avoided by optimizing the deposition process, since a drastic morphological change at the phase transformation to SnO_2 during annealing may destroy the integrity of the thin films and degrade the long-term stability of tin oxide films used as gas sensors at high temperatures.
机译:使用SnO_2靶通过离子束溅射(IBS)在硅基板上沉积非晶氧化锡膜。通过X射线衍射和扫描电子显微镜研究了不同退火温度下沉积膜的相变和形貌变化。所沉积的膜的结晶在350℃开始,并且SnO和SnO_2相在400℃形成。在450den.C下观察到SnO歧化为Sn和SnO_2,然后在550℃下氧化金属锡。在此温度下,伴随着金属锡的氧化而产生的大量体积变化会导致薄膜部分脱落并形成严重的皱纹。这些结果表明,应通过优化沉积工艺来避免氧化锡薄膜的氧气不足,因为退火期间在向SnO_2的相变过程中发生剧烈的形态变化可能会破坏薄膜的完整性并降低锡的长期稳定性。高温下用作气体传感器的氧化膜。

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