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Development of BaTiO_3 Based X7R Wafers for Single-Layer Capacitors

机译:基于BaTiO_3的单层电容器X7R晶片的开发

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Research on the development and characterization of X7R BaTiO_3 dielectric wafers for high frequency single-layer capacitors has been carried out. Commercial BaTiO_3 powders were processed and optimized in dielectric constant (ε_r), dissipation factor (DF) and temperature coefficient of capacitance (TCC). The results indicate a strong effect of sintering temperature on dielectric properties as well as on mechanical properties of the BaTiO_3. It has been shown that the highest dielectric constant is achieved at high sintering temperatures ( > 1400℃) and lowest TCC at lower sintering temperatures ( < 1300℃). By optimizing fabrication process e.g. dry pressing, cold isostatic pressing, sintering, and machining such as grinding and lapping, BaTiO_3 wafers of dielectric constant from 3400 to 3600, with a diameter approximately 50mm and thickness 150μm, have been manufactured successfully. The fabricated thin wafers exhibit the X7R capacitor characteristics of the dissipation factor ( < 3%) and temperature coefficient of capacitance ( < +- 15%) in the temperature range of-55℃ to 125℃.
机译:已经对用于高频单层电容器的X7R BaTiO_3介电晶片的开发和表征进行了研究。对市售的BaTiO_3粉末进行了处理,并优化了介电常数(ε_r),耗散因数(DF)和电容温度系数(TCC)。结果表明烧结温度对BaTiO_3的介电性能以及机械性能有很大的影响。结果表明,在较高的烧结温度(> 1400℃)下可获得最高的介电常数,而在较低的烧结温度(<1300℃)下可获得最低的TCC。通过优化制造工艺干压,冷等静压,烧结和机械加工(例如研磨和研磨)已成功制造出介电常数为3400至3600的BaTiO_3晶片,其直径约为50mm,厚度为150μm。所制造的薄晶片在-55℃至125℃的温度范围内具有X7R电容器的耗散系数(<3%)和电容温度系数(<+-15%)的特性。

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