Development and optimization of a cryogenic-aerosol-based wafer-cleaning system

摘要

A summary of recent advances in cryogenic-aerosol-based wafer-processing technology for semiconductor wafer cleaning is presented. An argon/nitrogen cryogenic-aerosol-based tool has been developed and optimized for removal of particulate contaminants. The development of the tool involved a combination of theoretical (modeling) and experimental efforts aimed at understanding the mechanisms of aerosol formation and the relation between aerosol characteristics and particle-removal ability. It is observed that the highest cleaning efficiencies are achieved, in general, when the cryogenic aerosol is generated by the explosive atomization of an initially liquid jet of the cryogenic mixture.