首页> 外文期刊>Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures >Microstructural defects in metalorganic vapor phase epitaxy of relaxed, graded InGaP: Branch defect origins and engineering
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Microstructural defects in metalorganic vapor phase epitaxy of relaxed, graded InGaP: Branch defect origins and engineering

机译:缓和梯度InGaP在金属有机气相外延中的微结构缺陷:分支缺陷的起源和工程

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Strain-relaxed, compositionally graded InGaP layers grown by atmospheric-pressure metalorganic vapor phase epitaxy (APMOVPE) have previously been found to exhibit unusual contrast in transmission electron microscopy (TEM). The features that generate this contrast were termed "branch defects." Branch defects have been shown to pin threading dislocations and are thus undesirable features for the realization of low dislocation density semiconductors'. In this study, we compare the properties of branch defects formed during optimized, relaxed, graded InGaP buffer deposition in two different reactor configurations: a commercial, multiwafer, low-pressure reactor and a custom-built, atmospheric-pressure research reactor. Branch defect formation is further characterized via the introduction of in situ annealing interruptions during graded buffer deposition in the atmospheric-pressure system. Branch defects are observed in material from both reactor systems, suggesting that they are a phenomenon intrinsic to InGaP graded buffer growth. Careful TEM studies of the resulting samples reveal that the phase space for the formation of branch defects is similar in both reactor configurations. During standard optimized graded buffer growth, higher growth temperatures delay the onset of branch defect formation to higher indium fractions in the graded buffer. Low growth temperatures produce branch defects at lower indium fractions, and these defects tend to be more closely spaced. In addition, the formation of branch defects is favored by low V/III ratios and in situ growth interruption and annealing. Annealing is found to create anisotropic strain relaxation in the graded buffer, which we attribute to the blocking of gliding threading dislocations by preferentially oriented branch defects. Based on the observed properties of branch defects and the factors that affect their formation, it appears that these defects are a manifestation of local variations in indium concentration that develop on the sample surface during MOVPE and are buried in the bulk due to kinetic limitations. (C) 2004 American Vacuum Society.
机译:先前已发现,通过大气压金属有机气相外延(APMOVPE)生长的应变松弛,成分渐变的InGaP层在透射电子显微镜(TEM)中显示出不同寻常的对比度。产生这种对比的特征称为“分支缺陷”。已经显示出分支缺陷会钉扎螺纹位错,因此对于实现低位错密度的半导体来说是不希望有的特征。在这项研究中,我们比较了两种不同反应堆配置中优化,松弛,分级InGaP缓冲沉积过程中形成的分支缺陷的性质:商用多晶片低压反应堆和定制的大气压研究反应堆。通过在大气压系统中梯度缓冲液沉积过程中引入原位退火中断来进一步表征分支缺陷的形成。在两个反应器系统的材料中均观察到分支缺陷,表明它们是InGaP梯度缓冲液生长所固有的现象。对所得样品的仔细TEM研究表明,在两种反应堆配置中,形成分支缺陷的相空间都相似。在标准优化的渐变缓冲液生长过程中,较高的生长温度会延迟在渐变缓冲液中较高的铟含量引起分支缺陷形成的开始。低的生长温度在较低的铟含量下产生分支缺陷,并且这些缺陷倾向于更紧密地间隔。此外,低V / III比以及原位生长中断和退火有利于形成分支缺陷。发现退火会在渐变缓冲区中产生各向异性应变松弛,这归因于优先定向的分支缺陷对滑动螺纹位错的阻止。根据观察到的分支缺陷的性质和影响分支缺陷形成的因素,这些缺陷似乎是铟浓度局部变化的一种表现,铟含量的变化是在MOVPE期间在样品表面上形成的,并由于动力学限制而被掩埋在主体中。 (C)2004年美国真空学会。

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