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Hot-pressed AlN-Cu metal matrix composites and their thermal properties

机译:热压AlN-Cu金属基复合材料及其热性能

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摘要

AlN-Cu metal matrix composites containing AlN volume fractions between 0.1 and 0.5 were fabricated firstly by liquid phase sintering of AlN using Y2O3 as a sintering aid and then by hot pressing the powder mixtures of sintered AlN and Cu at 1050°C with a pressure of 40 MPa under flowing nitrogen. With Y2O3 additions of 1.5 to 10 wt%, the densification of AlN could be achieved by liquid phase sintering at 1900°C for 3 h and subsequently slow cooling. The sintered AlN showed a maximum thermal conductivity of 166 W/m/K at a Y2O3 level of 6 wt%. Dense AlN-Cu composites with AlN contents up to 40 vol% were achieved by hot pressing. The thermal conductivity and the coefficient of the thermal expansion (CTE) of the composites decreased with increasing AlN volume fractions, giving typical values of 235 W/m/K and 12.6 × 10−6/K at an AlN content of 40 vol%.
机译:首先通过以Y2 O3 为烧结助剂对AlN进行液相烧结,然后将烧结后的AlN和AlN的粉末混合物热压,制备出AlN体积分数在0.1-0.5之间的AlN-Cu金属基复合材料。在氮气流下,在1050°C和40 MPa压力下的Cu。通过添加1.5至10 wt%的Y2O3 ,可以通过在1900°C下液相烧结3小时并随后缓慢冷却来实现AlN的致密化。烧结的AlN在6wt%的Y2 O3 水平下显示出最大热导率为166 W / m / K。通过热压获得了AlN含量高达40%(体积)的致密AlN-Cu复合材料。随着AlN体积分数的增加,复合材料的导热系数和热膨胀系数(CTE)降低,当AlN含量为20%时,典型值为235 W / m / K和12.6×10-6 / K。 40体积%。

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  • 来源
    《Journal of Materials Science》 |2004年第4期|1309-1313|共5页
  • 作者

    J. Tian; K. Shobu;

  • 作者单位

    National Institute of Advanced Industrial Science and Technology (AIST) Kyushu Center;

    National Institute of Advanced Industrial Science and Technology (AIST) Kyushu Center;

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  • 正文语种 eng
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