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Hot-pressed AlN-Cu metal matrix composites and their thermal properties

机译:热压AlN-Cu金属基复合材料及其热性能

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AlN-Cu metal matrix composites containing AlN volume fractions between 0.1 and 0.5 were fabricated firstly by liquid phase sintering of AlN using Y2O3 as a sintering aid and then by hot pressing the powder mixtures of sintered AlN and Cu at 1050degreesC with a pressure of 40 MPa under flowing nitrogen. With Y2O3 additions of 1.5 to 10 wt%, the densification of AlN could be achieved by liquid phase sintering at 1900degreesC for 3 h and subsequently slow cooling. The sintered AlN showed a maximum thermal conductivity of 166 W/m/K at a Y2O3 level of 6 wt%. Dense AlN-Cu composites with AlN contents up to 40 vol% were achieved by hot pressing. The thermal conductivity and the coefficient of the thermal expansion (CTE) of the composites decreased with increasing AlN volume fractions, giving typical values of 235 W/m/K and 12.6 x 10(-6)/K at an AlN content of 40 vol%. (C) 2004 Kluwer Academic Publishers. [References: 17]
机译:首先通过以Y2O3为烧结助剂对AlN进行液相烧结,然后在1050°C和40 MPa的压力下热压烧结的AlN和Cu的粉末混合物,制备出AlN体积分数在0.1-0.5之间的AlN-Cu金属基复合材料在氮气流下。通过添加1.5至10 wt%的Y2O3,可以通过在1900℃下液相烧结3小时并随后缓慢冷却来实现AlN的致密化。在6重量%的Y 2 O 3水平下,烧结的AlN显示出最大热导率为166W / m / K。通过热压获得了AlN含量高达40%(体积)的致密AlN-Cu复合材料。随着AlN体积分数的增加,复合材料的热导率和热膨胀系数(CTE)降低,当AlN含量为40 vol时,典型值分别为235 W / m / K和12.6 x 10(-6)/ K %。 (C)2004 Kluwer学术出版社。 [参考:17]

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