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机译:导电胶中铜合金填料上不同合金含量的电气可靠性
Joining and Welding Research Institute, Osaka University,11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan,School of Materials Engineering, University Malaysia Perlis,02600 Jejawi, Perlis, Malaysia;
Graduate School of Engineering, Osaka University,2-1 Yamadaoka, Suita, Osaka 565-0871, Japan;
Joining and Welding Research Institute, Osaka University,11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;
Joining and Welding Research Institute, Osaka University,11-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;
Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center,1333-2 Haraichi, Ageo, Saitama 362-0021, Japan;
Mitsui Mining & Smelting Co. Ltd. Corporate R & D Center,1333-2 Haraichi, Ageo, Saitama 362-0021, Japan;
Kamioka Mining & Smelting Co. Ltd, 1-1, Shikama, Kamioka,Hida, Gifu 506-1114, Japan;
机译:导电胶中铜合金填料上不同合金含量的电气可靠性
机译:包含导电胶的铜和铜合金颗粒的电性能
机译:低熔点合金填料填充的新型导电胶
机译:牺牲阳极填料对导电粘合剂与无铅合金表面接触电阻稳定性的影响
机译:导电胶的电气,热机械和可靠性建模。
机译:三维石墨烯/纳米填料(Al2O3BN或TiO2)树脂的结构设计及其在导电胶中的应用
机译:用铜填料覆盖银涂层对导电粘合剂电阻率的影响
机译:嬗变,空隙膨胀和通量/光谱不确定性对铜和铜合金电性能的影响