COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, COPPER ALLOY THIN SHEET FOR ELECTRONIC OR ELECTRICAL DEVICE, PROCESS FOR MANUFACTURING COPPER ALLOY FOR ELECTRONIC OR ELECTRICAL DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC OR ELECTRICAL DEVICE, AND TERMINAL

摘要

A copper alloy for an electric and electronic device includes more than 2.0 mass% to 36.5 mass% of Zn, 0.1 mass% to 0.9 mass% of Sn, 0.05 mass% to less than 1.0 mass% ofNi, 0.5 mass ppm to less than 10 mass ppm of Fe, 0.001 mass% to less than 0.10 mass% of Co, 0.001 mass% to 0.10 mass% of P, and a balance including Cu and unavoidable impurities, in which, ratios between the amounts of the respective elements satisfy 0.002‰¤Fe/Ni1.5, 3(Ni+Fe)/P15, and 0.3Sn/(Ni+Fe)5 by atomic ratio, and the copper alloy includes a precipitate containing P and at least one element selected from the group consisting of Fe, Co and Ni.