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Contactless inspection of electrically isolated electronic components of planar electronic devices by capacitive coupling (Conference Paper)

机译:通过电容耦合对平面电子设备的电气隔离电子组件进行非接触式检查(会议论文)

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摘要

During the early steps of the production process, printed electronic circuits and devices such as flat panel displays and detector panels consist of a large number of electrically isolated components. Detection and thus inspection of isolated electronic parts by capacitive coupling only becomes possible if an appropriate sensor design is chosen. Therefore, the dependence of sensor performance on sensor design was analyzed by means of finite element simulations based on the nonmatching grid approach. A clear detection of individual components is achieved if the sensor imposes a non-uniform potential distribution along the boundary surface of the substrate that carries the electronic components. Sensor resolution can drastically be increased by shielding specific sensor electrode areas or employing an additional shielding encompassing the sensor electrode. From the analysis of the simulation results, design rules for sensor electrode and shielding geometry are deduced. Finally, the performances of a sensor obeying to the deduced design rules and a currently employed sensor are compared with regard to directly electrically accessible components.
机译:在生产过程的早期阶段,诸如平板显示器和检测器面板之类的印刷电子电路和设备由大量电绝缘组件组成。只有选择了合适的传感器设计,才有可能通过电容耦合检测并检查隔离的电子零件。因此,通过基于非匹配网格方法的有限元模拟,分析了传感器性能对传感器设计的依赖性。如果传感器沿承载电子组件的基板的边界表面施加不均匀的电势分布,则可以清楚地检测单个组件。通过屏蔽特定的传感器电极区域或采用包围传感器电极的附加屏蔽层,可以大大提高传感器分辨率。通过对仿真结果的分析,得出了传感器电极和屏蔽几何形状的设计规则。最后,将关于推导的设计规则的传感器和当前采用的传感器的性能与可直接电访问的组件进行比较。

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