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机译:保持时间对高温下无铅焊点机械疲劳破坏行为的影响
School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100024, People's Republic of China;
School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100024, People's Republic of China;
School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100024, People's Republic of China;
School of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100024, People's Republic of China;
机译:高温下无铅焊点的低周疲劳失效行为及寿命评估
机译:SnAgCu / Cu焊点的高温机械疲劳破坏行为研究
机译:无铅焊料微焊接头的机械弯曲疲劳研究
机译:研究焊料厚度对高温下焊点疲劳破坏行为的影响
机译:研究无铅焊点的热疲劳模型特性和优化温度循环曲线。
机译:电子设备中无铅焊点的可靠性问题
机译:芯片组件无铅焊点的疲劳寿命散射(<特殊问题>电子设备和机械工程的热电机械可靠性)
机译:保持时间,应变速率和环境对近共晶sn-pb焊料的热机械疲劳影响。