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机译:热循环条件下Sn-Ag-Cu / Co-P球栅阵列焊点的IMC生长和剪切强度
Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China,School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, People's Republic of China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, People's Republic of China,Tsinghua National Laboratory for Information Science and Technology, Beijing 100084, People's Republic of China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, People's Republic of China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, People's Republic of China;
Institute of Microelectronics, Tsinghua University, Beijing 100084, People's Republic of China;
Key Laboratory of Advanced Materials (MOE), School of Materials Science and Engineering, Tsinghua University, Beijing 100084, People's Republic of China;
机译:锡-银-铜焊料接头的微观结构和取向演变与位置和热循环在球栅阵列中的位置成像显微镜的使用。
机译:锡-银-铜焊料接头的微观结构和取向演变与位置和热循环在球栅阵列中的位置成像显微镜的使用。
机译:等温时效对具有不同Sn-Ag-Cu焊点的细间距球栅阵列封装的长期可靠性的影响
机译:CoSn3金属间化合物显着提高了Sn-Ag-Cu / Co-P球栅阵列焊点的剪切强度
机译:用共晶铅锡和无铅焊料对塑料球栅阵列,芯片规模和倒装芯片封装的焊球剪切强度进行调查和分析。
机译:纳米粒子添加对不同热条件下Cu / Sn-Ag-Cu / Cu焊点中金属间化合物(IMCs)的形成和生长的影响
机译:Sn相的微观结构和取向演化与Sn-Ag-Cu球栅阵列中位置的关系焊点