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Optimization of the annealing process and nanoscale piezoelectric properties of (002) AlN thin films

机译:(002)AlN薄膜的退火工艺和纳米级压电性能的优化

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摘要

In this paper, the effects of different annealing processes on the texture, surface morphology, and piezoelectric properties of aluminum nitride (AlN) thin films and the performance of AlN-based surface acoustic wave (SAW) devices were systematically investigated. Based on the crystallinity and the morphology results, it is evident that in-situ annealing method is superior to ex-situ annealing. For the A1N thin films, the crystallization and piezoelectricity were both enhanced and then receded as the annealing temperature increased from 300 to 600 ℃. We demonstrated that good (002) orientation, excellent grain distribution and high relative piezoelectric coefficient of the AlN thin films were achieved via in-situ annealing at 500 ℃. Meanwhile, the AlN thin films exhibited excellent polarization properties and polarization maintaining characteristics. Additionally, the uniform interdigital transducer (IDT) with 8 μm period (finger width = 2 μm) were designed and the IDT/AlN/SiO_2/Si SAW devices with the center frequency f_0 of 495 MHz and insert loss of -24.1 dB were fabricated.
机译:本文系统地研究了不同退火工艺对氮化铝(AlN)薄膜的织构,表面形态和压电性能以及基于AlN的表面声波(SAW)器件性能的影响。根据结晶度和形态结果,很明显原位退火方法优于异位退火。对于AlN薄膜,随着退火温度从300℃升高到600℃,其结晶度和压电性均增强,然后下降。通过在500℃下进行原位退火,我们证明了AlN薄膜具有良好的(002)取向,优异的晶粒分布和较高的相对压电系数。同时,AlN薄膜表现出优异的偏振特性和偏振保持特性。此外,设计了周期为8μm(手指宽度= 2μm)的均匀叉指换能器(IDT),并制造了中心频率f_0为495 MHz且插入损耗为-24.1 dB的IDT / AlN / SiO_2 / Si SAW器件。

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  • 来源
    《Journal of materials science》 |2017年第13期|9295-9300|共6页
  • 作者单位

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

    School of Electrical and Electronic Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, 391 West Binshui Road, Tianjin 300384, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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