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Band structure and thermoelectric properties of Al-doped Mg_(3-x)Al_xSb_2 compounds

机译:Al掺杂Mg_(3-x)Al_xSb_2化合物的能带结构和热电性能

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Mg3Sb2-based compounds demonstrate promise as thermoelectric materials due to their cost-effectiveness, abundance and high-performance. However, the poor electrical conductivity limits the thermoelectric performance for both p-type and n-type compounds. In this study, Al-doped Mg3-xAlxSb2 samples were successfully fabricated by the high-temperature high-pressure and hot pressing sintering technique. Doping with Al decreased the hole carrier concentration of p-type Mg3Sb2 and transformed the persistent p-type material into an n-type semiconductor with the increase in the Al content to x = 0.2. The Fermi level moved toward the conduction band and the band gap tended to be narrower with the increase in the Al content. The Mg2 site was the most possible location that Al atoms replace. Meanwhile, the lattice thermal conductivity decreased significantly by doped with Al. This study of doping with Al provided an alternative strategy for the enhancement of the thermoelectric properties in n-type Mg3Sb2-based materials.
机译:基于Mg3Sb2的化合物因其成本效益,丰度和高性能而显示出作为热电材料的前景。但是,差的电导率限制了p型和n型化合物的热电性能。在这项研究中,通过高温高压和热压烧结技术成功地制备了掺铝的Mg3-xAlxSb2样品。 Al的掺杂降低了p型Mg3Sb2的空穴载流子浓度,并且随着Al含量增加到x = 0.2,将持久的p型材料转变为n型半导体。费米能级向导带移动,并且随着Al含量的增加,带隙趋于变窄。 Mg2位点是Al原子取代的最可能的位置。同时,掺杂Al使晶格热导率明显降低。铝掺杂的这项研究为增强n型Mg3Sb2基材料的热电性能提供了另一种策略。

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