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机译:在260℃下银箔与金属化氧化铝基底的固态键合
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California, Irvine, CA 92697-2660;
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California, Irvine, CA 92697-2660;
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California, Irvine, CA 92697-2660;
Electrical Engineering and Computer Science, Materials and Manufacturing Technology, University of California, Irvine, CA 92697-2660;
fluxless bonding; solid state bonding; silver; alumina;
机译:硅芯片与氧化铝基板的低温固态银键合
机译:固态结合陶瓷-金属的粘合机理:银-氧化铝对的案例
机译:低压固态粘接技术,采用精细颗粒银箔进行高温电子产品
机译:适用于大功率电子应用的具有银固溶体涂层的可粘接铜基板
机译:微观特征增强了金属注射成型(MIM)零件与固体基材的烧结结合。
机译:通过金属增强的荧光从固体基质上固定的银纳米颗粒进行DNA检测的模型
机译:氧化铝组成和W粒径对W金属化氧化铝基材的粘接强度的影响。
机译:银 - 银固态结合中银的表面污染及其对内聚力的影响