Six Companies Prepare for 300mmΦWafer Fabs

摘要

In the second half of 2001 there may be six companies preparing for 300mmΦwafers. However, Hyundai Electronics Industries Co., Ltd., Micron Technology, Inc., and Samsung Electronics Co., Ltd. will not be part of this trend for now. These companies are following a strategy of shrinking die size to get extra chips from a 200mmΦwafer. Samsung, for example, has recently qualified a 0.13μm process that it plans to use for its 64M-bit devices in 1999.