Process, environmental economical considerations to implement single wafer cleaning tools in 300mm wafer fabs

摘要

Similar electrical performances and CoO are obtained by performing pre-diffusion cleaning in a conventional 300mm wet bench & on a single wafer using fresh chemical. The drastic reduction of cycle time, DIW consumption, tool complexity & footprint combined with higher flexibility will drive the ASIC market to switch most of the cleaning steps from batch to S W.