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Nonlinear and linearized algorithms for the Young's modulus extraction of thin films through the capacitance-voltage measurement of microstructures

机译:通过微结构的电容电压测量来提取薄膜的杨氏模量的非线性和线性化算法

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摘要

Two high-precision algorithms, based on nonlinear and linearized models, for the Young's modulus extraction of thin films through the wafer-level capacitance-voltage (C-V) measurement of microstructures are developed and compared with each other. Two microcantilever beams made of single crystalline silicon are used to verify the present methodologies since the Young's modulus of single crystalline silicon has been well defined. The average value of the Young's modulus in (110) crystalline plane extracted by the present methods is about 170 GPa, and the error is within 2% compared to the well-defined value of 168 GPa. Thus, the accuracy and precision of the present methodology are verified. The results obtained by the nonlinear algorithm seem to be a little better than the ones obtained by the linearized algorithm. However, the linearized algorithm can provide the Young's modulus as an explicit function of capacitance and voltage and can self-eliminate the capacitance measurement error from the bias-unrelated parasitic capacitances caused by the layout, the probing lines, or the misalignment of upper and bottom electrodes. The present methods could be accomplished using existing semiconductor testing equipments through probing on the bonding pads of devices because the driving and measured signals are both electrical. Since hardware replacement could be avoided, the present methodology shows substantial advantage over other property-extraction methods for large-scale implementation in semiconductor or microelectromechanical system fabrications.
机译:开发了两种基于非线性和线性化模型的高精度算法,用于通过微结构的晶圆级电容-电压(C-V)测量来提取薄膜的杨氏模量,并将它们相互比较。由于已经很好地定义了单晶硅的杨氏模量,所以使用由单晶硅制成的两个微悬臂梁来验证本方法。通过本方法提取的(110)晶面中的杨氏模量的平均值为约170GPa,并且与确定的168GPa的值相比,误差在2%以内。因此,验证了本方法的准确性和精确性。非线性算法获得的结果似乎比线性算法获得的结果要好一些。但是,线性化算法可以提供杨氏模量作为电容和电压的显式函数,并且可以消除由布局,探测线或上下不对齐引起的与偏置无关的寄生电容引起的电容测量误差。电极。由于驱动信号和测量信号都是电的,因此可以使用现有的半导体测试设备通过探测设备的焊盘来实现本方法。由于可以避免硬件更换,因此本方法相对于用于半导体或微机电系统制造中的大规模实施的其他特性提取方法显示出实质性优势。

著录项

  • 来源
    《Journal of Applied Physics》 |2005年第10期|p.104504.1-104504.6|共6页
  • 作者

    Yuh-Chung Hu; Wei-Hsiang Tu;

  • 作者单位

    Department of Mechatronic Engineering, Huafan University, No.1, Huafan Rd., Shintin, Taipei Hsien 223, Taiwan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 应用物理学;计量学;
  • 关键词

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