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首页> 外文期刊>Journal of Applied Physics >Performance of shape-varying magnetic tunneling junction for high-speed magnetic random access memory cells
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Performance of shape-varying magnetic tunneling junction for high-speed magnetic random access memory cells

机译:高速磁性随机存取存储单元的异形磁性隧道结性能

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摘要

We have developed a shape-varying magnetic tunneling junction (MTJ) (SVM) which has a high MR ratio and low write current for use in high-speed magnetic random access memory (MRAM) cells. Combining NiFe that has low anisotropy to CoFeB which has high anisotropy through the nonmagnetic layer by interlayer exchange coupling (synthetic ferromagnetic coupling free layer: SFF), the anisotropy of SFF was reduced much more than that of CoFeB, and the MR ratio was improved much more than that of NiFe. The switching magnetic field (H_(sw)) of SFF was reduced as the thickness of NiFe increased. The H_(sw)of SFF for 0.24 × 0.48 μm~2 MTJ was 30 Oe when the thickness of CoFeB was 1.5 nm and that of NiFe was 3.0 nm. Furthermore H_(sw) was reduced to 18 Oe by varying the shape of the MTJ of NiFe to 0.48 × 0.48 μm~2; the shape of the MTJ of CoFeB was not changed (0.24 × 0.48 μm~2). Combining the SVM and a write-line-inserted structure, we obtained a write current of 0.9 mA and an MR ratio of 140%. The H_(sw) was 40 Oe and its thermal stability factor was 82. These properties are sufficient for operating MRAMs over 500 MHz.
机译:我们已经开发出一种具有高MR比和低写入电流的形状变化的磁性隧道结(MTJ)(SVM),用于高速磁性随机存取存储器(MRAM)单元。通过层间交换耦合(各向异性铁磁耦合自由层:SFF),将各向异性低的NiFe与通过非磁性层的各向异性高的CoFeB组合,与CoFeB相比,SFF的各向异性大大降低。超过镍铁。随着NiFe的厚度增加,SFF的开关磁场(H_(sw))减小。当CoFeB的厚度为1.5 nm,NiFe的厚度为3.0 nm时,SFF在0.24×0.48μm〜2 MTJ下的H_(sw)为30 Oe。通过将NiFe的MTJ的形状改变为0.48×0.48μm〜2,H_(sw)降至18 Oe。 CoFeB的MTJ形状不变(0.24×0.48μm〜2)。结合SVM和插入写入线的结构,我们获得了0.9 mA的写入电流和140%的MR比。 H_(sw)为40 Oe,热稳定性因子为82。这些特性足以在500 MHz以上的MRAM中工作。

著录项

  • 来源
    《Journal of Applied Physics》 |2009年第3期|160-162|共3页
  • 作者单位

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

    Device Platforms Research Laboratories, NEC Corporation, Sagamihara 229-1198, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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