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Effects of surface oxide layer on nanocavity formation and silver getter ing in hydrogen ion implanted silicon

机译:表面氧化物层对氢离子注入硅中纳米腔形成和吸银的影响

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摘要

We have made an investigation of the surface oxide effects on nanocavity formation in hydrogen implanted silicon and the influence of resultant nanocavities on diffusion and gettering of implanted silver atoms. A wafer with a 200-nm SiO_2 surface layer was implanted with 22.5 keV H ions to a dose of 1 × 10~(17) cm~(-2), yielding the concentration peak of implanted H ions at ~140nm below the SiO_2/Si interface. Subsequently, two sets of Si samples were prepared, depending on whether the oxide layer was etched off before (Group-A) or after (Group-B) post-H-implantation annealing. As evidenced by transmission electron microscopy, Group-A samples exhibited an array of large-sized nanocavities in hexagon-like shape, extending from the surface to the depth ~140nm, whereas a narrow band of sphere-shaped nanocavities of small size was present around 140 nm below the surface in Group-B samples. These Si samples with pre-existing nanocavities were further implanted with Ag ions in the surface region (~40nm projected range) and post-Ag-implantation annealing was conducted in the temperature range between 600 and 900 ℃. Measurements based on Rutherford backscattering spectroscopy revealed much different behaviors for Ag redistribution and defect accumulation in these two sets of samples. Compared to the case for Group-B Si, Group-A Si exhibited a lower concentration of residual defects and a slower kinetics in Ag diffusion as well. We discuss the role of thick surface oxide in point defect generation and recombination, and the consequence on nanocavity formation and defect retention in Si. The properties of nanocavities, e.g., their depth distribution, size, and even shape, are believed to be responsible for the observed disparities between these samples, including an interesting contrast of surface vs. bulk diffusion phenomena for implanted Ag atoms.
机译:我们已经研究了表面氧化物对注入氢的硅中纳米腔形成的影响以及所得纳米腔对注入的银原子的扩散和吸杂的影响。在具有200nm SiO_2表面层的晶片上注入22.5 keV H离子,剂量为1×10〜(17)cm〜(-2),从而在SiO_2 /以下约140nm处注入H离子的浓度峰。 Si接口。随后,根据在H-注入后退火(A组)之前或之后(B组)是否腐蚀掉氧化物层,制备两组Si样品。如透射电子显微镜所证明的,A组样品显示出六边形形状的大型纳米腔阵列,从表面延伸到约140nm的深度,而在附近存在窄带的小尺寸球形纳米腔B组样品中表面以下140 nm。将这些具有预先存在的纳米腔的Si样品在表面区域(投影范围约为40nm)中注入Ag离子,并在600至900℃的温度范围内进行Ag注入后的退火。基于卢瑟福背散射光谱的测量结果表明,这两套样品中银的再分布和缺陷积累行为各不相同。与B族Si的情况相比,A族Si表现出较低的残留缺陷浓度和较慢的Ag扩散动力学。我们讨论了厚表面氧化物在点缺陷产生和复合中的作用,以及纳米腔形成和硅中缺陷保留的后果。纳米腔的性质,例如它们的深度分布,大小,甚至形状,被认为是造成这些样品之间观察到的差异的原因,其中包括注入的Ag原子的表面扩散与体积扩散现象的有趣对比。

著录项

  • 来源
    《Journal of Applied Physics》 |2013年第2期|023502.1-023502.8|共8页
  • 作者单位

    College of Nanoscale Science and Engineering, University at Albany-SUNY, Albany, New York 12203, USA;

    Department of Physics, University at Albany-SUNY, Albany, New York 12222, USA;

    College of Nanoscale Science and Engineering, University at Albany-SUNY, Albany, New York 12203, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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