首页> 外文会议>European Photovoltaic Solar Energy Conference >OPTIMIZATION OF CONTACT HOLE FORMATION PROCESS BY REACTIVE ION ETCHING FOR CUBIC SILICON CARBIDE/SILICON HETEROJUNCTION SOLAR CELLS WITH HYDROGENATED AMOURPHOUS ALUMINUM OXIDE REAR SURFACE PASSIVATION LAYER
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OPTIMIZATION OF CONTACT HOLE FORMATION PROCESS BY REACTIVE ION ETCHING FOR CUBIC SILICON CARBIDE/SILICON HETEROJUNCTION SOLAR CELLS WITH HYDROGENATED AMOURPHOUS ALUMINUM OXIDE REAR SURFACE PASSIVATION LAYER

机译:用氢化氨基氧化铝后表面钝化层的立方碳化硅/硅杂官杂交太阳能电池反应离子蚀刻优化接触孔形成过程

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Amorphous aluminum oxide (a-Al_(1-x)O_x:H) is one of the promising materials for the rear surface passivation layer of crystalline silicon (c-Si) solar cells. a-Al_(1-x)O_x:H films with good passivation quality for p-type c-Si were deposited by plasma enhance chemical vapor deposition (PECVD). We employed a reactive ion etching (RIE) technique to make contact holes for a-Al_(1-x)O_x:H passivation layer and optimized RIE conditions and thermal annealing conditions after metal evaporation. Under the optimum condition, good ohmic contact with low contact resistance was realized. A good fill factor of 0.795 was obtained for n-type nanocrystalline cubic silicon carbide/p-type c-Si heterojunction solar cells with the RIE contact process.
机译:非晶氧化铝(A-Al_(1-x)O_x:H)是结晶硅(C-Si)太阳能电池的后表面钝化层的有希望的材料之一。通过等离子体增强化学气相沉积(PECVD)沉积具有良好钝化质量的A-AL_(1-X)O_x:H膜具有良好的p型C-Si。我们采用反应离子蚀刻(RIE)技术,用于使A-Al_(1-x)O_x:H钝化层和优化的RIE条件和金属蒸发后的热退火条件进行接触孔。在最佳条件下,实现了与低接触电阻的良好欧姆接触。用RIE接触过程获得N型纳米晶立方碳化硅/ P型C-Si异质结太阳能电池,得到0.795的良好填充因子。

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