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Chemo-mechanical softening during in situ nanoindentation of anodic porous alumina with anodization processing

机译:阳极氧化工艺对阳极多孔氧化铝原位纳米压痕的化学机械软化

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摘要

Simultaneous application of mechanical stresses on a material as it undergoes an electrochemical reaction can result in interesting coupling effects between the chemical and mechanical responses of the material. In this work, anodic porous alumina supported on Al is found to exhibit significant softening during in situ nanoindentation with anodization processing. Compared with ex situ nanoindentation without anodization processing, the in situ hardness measured on the alumina is found to be much lower, when the estimated maximum stress underneath the indenter is exerted on the metal/ oxide (m/o) interface at the bottom of the oxide. Numerical calculation reveals that a high electric field exists across the nanometrically thin barrier layer where the electrochemical reactions mainly take place. In microindentation with a flat punch, in situ softening is also observed, but no significant difference in the deformation of the oxide and the Al substrate between in situ and ex situ cases can be observed from cross-sectional transmission electron microscopy examination. The evidence, therefore, indicates that the observed in situ softening is due to a combination of high compression stress and electric field acting near the m/o interface, and it is likely that such conditions enhance Al ionization at the m/o interface, thus causing the m/o interface to move faster into the Al substrate under the in situ condition.
机译:在材料发生电化学反应时,在其上同时施加机械应力会导致材料的化学和机械响应之间产生有趣的耦合效应。在这项工作中,发现在阳极氧化处理的原位纳米压痕过程中,负载在Al上的阳极多孔氧化铝表现出明显的软化。与未经阳极氧化处理的非原位纳米压痕相比,当在压头底部的金属/氧化物(m / o)界面上施加压头下方的最大应力时,发现在氧化铝上测得的原位硬度要低得多。氧化物。数值计算表明,在整个纳米薄的阻挡层中都存在高电场,在该处主要发生电化学反应。在用平冲头进行的微压痕中,也观察到了原位软化,但是从横截面透射电子显微镜检查中,在原位和非原位情况下,氧化物和Al衬底的变形没有显着差异。因此,证据表明观察到的原位软化是由于高压缩应力和作用在m / o界面附近的电场的结合,并且这种条件可能会增强m / o界面的Al电离,因此导致在原位条件下,m / o界面更快地移入Al基板。

著录项

  • 来源
    《Journal of Applied Physics》 |2013年第18期|184903.1-184903.8|共8页
  • 作者

    Chuan Cheng; A. H. W. Ngan;

  • 作者单位

    Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong;

    Department of Mechanical Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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