...
首页> 外文期刊>Journal of Applied Physics >Intrinsic SiO_x-based unipolar resistive switching memory. Ⅱ. Thermal effects on charge transport and characterization of multilevel programing
【24h】

Intrinsic SiO_x-based unipolar resistive switching memory. Ⅱ. Thermal effects on charge transport and characterization of multilevel programing

机译:基于SiO_x的本征单极电阻切换存储器。 Ⅱ。热效应对电荷传输和多层编程特性的影响

获取原文
获取原文并翻译 | 示例
   

获取外文期刊封面封底 >>

       

摘要

Multilevel programing and charge transport characteristics of intrinsic SiO_x-based resistive switching memory are investigated using TaN/SiO_x~(++)Si (MIS) and TiW/SiO_x/TiW (MIM) device structures. Current transport characteristics of high- and low-resistance states (HRS and LRS) are studied in both device structures during multilevel operation. Analysis of device thermal response demonstrates that the effective electron energy barrier is strongly dependent on the resistance of the programed state, with estimates of 0.1 eV in the LRS and 0.6 eV in the HRS. Linear data fitting and conductance analyses indicate Poole-Frenkel emission or hopping conductance in the low-voltage region, whereas Fowler-Nordheim (F-N) or trap-assisted tunneling (TAT) is indicated at moderate voltage. Characterizations using hopping transport lead to hopping distance estimates of ~1 nm in the LRS for both device structures. Relative permittivity values (ε_r were extracted using the Poole-Frenkel formulism and estimates of local filament temperature, where ε_r values were ~80 in the LRS and ~4 in the HRS, suggesting a strongly polarized medium in the LRS. The onset of F-N tunneling or TAT corresponds to an observed "overshoot" in the Ⅰ-Ⅴ response with an estimated threshold of 1.6 ± 0.2 V, in good agreement with reported electroluminescence results for LRS devices. Resistive switching is discussed in terms of electrochemical reactions between common SiO_2 defects, and specific defect energy levels are assigned to the dominant transitions in the Ⅰ-Ⅴ response. The overshoot response in the LRS is consistent with TAT through either the Eγ' oxygen vacancy or the hydrogen bridge defect, both of which are reported to have an effective bandgap of 1.7 eV. The SET threshold at ~2.5 V is modeled as hydrogen release from the (Si-H)_2 defect to generate the hydrogen bridge, and the RESET transition is modeled as an electrochemical reaction that re-forms (SiH)_2. The results provide further insights into charge transport and help identify potential switching mechanisms in SiO_x-based unipolar resistive switching memory.
机译:利用TaN / SiO_x / n〜(++)Si(MIS)和TiW / SiO_x / TiW(MIM)器件结构研究了基于SiO_x的固有电阻开关存储器的多级编程和电荷传输特性。在多级操作期间,在两种器件结构中都研究了高阻态和低阻态(HRS和LRS)的电流传输特性。器件热响应分析表明,有效的电子能垒在很大程度上取决于编程状态的电阻,在LRS中估计为0.1 eV,在HRS中估计为0.6 eV。线性数据拟合和电导分析表明在低压区域出现Poole-Frenkel发射或跳跃电导,而Fowler-Nordheim(F-N)或陷阱辅助隧穿(TAT)处于中等电压。对于两种器件结构,使用跳变传输进行表征都会导致LRS的跳变距离估计约为1 nm。相对介电常数值(ε_r是使用Poole-Frenkel公式提取的,并估计了局部灯丝温度,其中ε_r值在LRS中约为〜80,在HRS中约为〜4,表明LRS中存在强极化介质。 TAT或TAT对应于Ⅰ-Ⅴ响应中观察到的“过冲”,估计阈值为1.6±0.2 V,这与所报道的LRS器件的电致发光结果非常吻合。根据常见SiO_2缺陷之间的电化学反应来讨论电阻切换,特定的能级被分配给Ⅰ-Ⅴ响应的主要转变,LRS的超调响应通过Eγ'的氧空位或氢桥缺陷与TAT相一致,据报道两者都具有有效的作用。带隙为1.7 eV。大约2.5 V时的SET阈值被建模为从(Si-H)_2缺陷释放氢以生成氢桥,而RESET过渡被建模为el形成(SiH)_2的化学反应。结果为电荷传输提供了进一步的见解,并有助于确定基于SiO_x的单极电阻式开关存储器中的潜在开关机制。

著录项

  • 来源
    《Journal of Applied Physics》 |2014年第4期|043709.1-043709.12|共12页
  • 作者单位

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    PrivaTran, LLC, 1250 Capital of Texas Highway South, Bldg 3, Ste 400, Austin, Texas 78746, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

    Microelectronics Research Center, Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78758, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号