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Preparation of Sn doped SiO_2 thin films by magnetron sputtering deposition using metal and metal-oxide powder targets

机译:金属和金属氧化物粉末靶磁控溅射沉积制备掺锡的SiO_2薄膜

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摘要

Tin (Sn) doped silicon dioxide (SiO2) thin films, for use in optical electronic devices, were prepared by the sputtering deposition method using two kinds of mixed powder targets. One of them was a metal mixed powder target of Sn and SiO2, and the others was a metal-oxide powder target of SnO2 and SiO2. Experimental results suggest that Sn doped SiO2 thin films can be prepared by the method using both powder targets. The properties of processing plasma, such as electron density and temperature, emission species, and the elements concentration ratio of the prepared films can be controlled by the ratio of the SnO2 and SiO2 powder target mixture using a SnO2 + SiO2 target. However, it is hard to control the processing plasma and elements concentration ratio of the prepared films using a Sn + SiO2 target. (C) 2018 The Japan Society of Applied Physics
机译:通过使用两种混合粉末靶的溅射沉积方法,制备了用于光学电子设备的掺锡(Sn)的二氧化硅(SiO2)薄膜。其中一个是Sn和SiO 2的金属混合粉末靶,另一个是SnO 2和SiO 2的金属氧化物粉末靶。实验结果表明,使用两种粉末靶均可通过该方法制备掺Sn的SiO2薄膜。可以通过使用SnO2 + SiO2靶材的SnO2和SiO2粉末靶材混合物的比例来控制处理等离子体的特性,例如电子密度和温度,发射物种以及所制备膜的元素浓度比。但是,使用Sn + SiO 2靶难以控制制得的膜的处理等离子体和元素浓度比。 (C)2018日本应用物理学会

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