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Ferroelectric properties of undoped HfO_2 directly deposited on Si substrates by RF magnetron sputtering

机译:射频磁控溅射直接沉积在Si衬底上的未掺杂HfO_2的铁电性能

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摘要

In this research, we have investigated the undoped HfO2 formation with a metastable orthorhombic phase on Si substrates and its substrate orientation dependence. A 24-nm-thick HfO2 was deposited by radio-frequency (RF) magnetron sputtering with an Ar/O-2 plasma utilizing a Hf target. It was found that metastable orthorhombic phase formation was enhanced at an Ar/O-2 flow ratio of 2.0/0.2 sccm followed by post-deposition annealing at 600 degrees C/30 s in N-2 ambient. The memory window (MW) extracted from the capacitance-voltage (C-V) characteristics measured at 100 kHz of Al/HfO2/p-Si(100) was increased from 0.39 to 0.84Vas the Ar/O-2 flow ratio during sputtering was increased from Ar/O-2 of 2.0/1.0 to 2.0/0.2 sccm. In the case of p-Si(111) substrates, the MW was increased to 0.99 V when the Ar/O-2 flow ratio was 2.0/0.2 sccm probably owing to the enhanced crystallization of the metastable orthorhombic phase. (C) 2018 The Japan Society of Applied Physics
机译:在这项研究中,我们研究了在Si衬底上具有亚稳斜方晶相的未掺杂HfO2的形成及其对衬底取向的依赖性。通过射频(RF)磁控管溅射,利用Hf靶材用Ar / O-2等离子体沉积24 nm厚的HfO2。已发现,在Ar / O-2流量比为2.0 / 0.2 sccm时,亚稳态斜方晶相的形成得以增强,随后在N-2环境中以600摄氏度/ 30 s进行沉积后退火。随着Al / HfO2 / p-Si(100)在100 kHz时测量的电容-电压(CV)特性提取的存储窗口(MW)从0.39V增加到0.84V,这是因为溅射过程中Ar / O-2流量比增加了Ar / O-2为2.0 / 1.0至2.0 / 0.2 sccm。在p-Si(111)衬底的情况下,当Ar / O-2流量比为2.0 / 0.2 sccm时,MW增加到0.99 V,这可能是由于亚稳正交晶相的结晶增强所致。 (C)2018日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2018年第11s期|11UF09.1-11UF09.4|共4页
  • 作者

    Kim Min Gee; Ohmi Shun-ichiro;

  • 作者单位

    Tokyo Inst Technol, Dept Elect & Elect Engn, Yokohama, Kanagawa 2268502, Japan;

    Tokyo Inst Technol, Dept Elect & Elect Engn, Yokohama, Kanagawa 2268502, Japan;

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