首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers & Short Notes >Oxidation of InAlAs and Its Application to Gate Insulator of InAlAs/InGaAs Metal Oxide Semiconductor High Electron Mobility Transistor
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Oxidation of InAlAs and Its Application to Gate Insulator of InAlAs/InGaAs Metal Oxide Semiconductor High Electron Mobility Transistor

机译:InAlAs的氧化及其在InAlAs / InGaAs金属氧化物半导体高电子迁移率晶体管栅绝缘子中的应用

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摘要

InAlAs was oxidized by UV and ozone process. Nanometer-order thin-oxide layers were generated in proportion to the square root of the process period, although their correlation with the period is poor compared with that of InGaAs. Oxidation initially decreased photoluminescence intensity from the InAlAs surface and then gradually increased it when the process period exceeded 15 min until it reached 4 h (crystallographic-order degradation followed by recovery). Plasma nitridation of InAlAs exhibited a gradual and monotonic decrease in photoluminescence intensity. Lattice-matched InAlAs/InGaAs metal-oxide-semiconductor high electron mobility transistors were fabricated utilizing gate oxide layers which were formed by 4 h oxidation. A transconductance of 200 mS/mm was obtained using a 1.5-μm-gate-length device, in a high-forward-gate-bias region although hysteresis was observed in the current-voltage curve.
机译:InAlAs被紫外线和臭氧工艺氧化。纳米级薄氧化物层与工艺周期的平方根成比例地产生,尽管它们与周期的相关性比InGaAs差。氧化最初会降低InAlAs表面的光致发光强度,然后在处理时间超过15分钟直至达到4 h时逐渐增加(晶体学级降解,然后恢复)。 InAlAs的等离子体氮化显示出光致发光强度的逐渐单调下降。晶格匹配的InAlAs / InGaAs金属氧化物半导体高电子迁移率晶体管利用通过4小时氧化形成的栅极氧化物层制造。尽管在电流-电压曲线中观察到磁滞现象,但在高前向栅极偏置区域中使用1.5μm栅极长度的器件可获得200 mS / mm的跨导。

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