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首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters & Express Letters >Nanocrystalline Silicon Embedded Zirconium-Doped Hafnium Oxide High-k Memory Device
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Nanocrystalline Silicon Embedded Zirconium-Doped Hafnium Oxide High-k Memory Device

机译:纳米晶硅嵌入锆掺杂的氧化Ha高k存储器件

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摘要

Memory devices containing the nanocrystalline Si embedded Zr-doped HfO_2 high-k dielectric film, which have many advantages over the conventional non-doped high-k films, have been prepared and characterized. The memory effect was manifested by the large counterclockwise capacitance-voltage hysteresis, e.g., 2.98 V, and negative differential resistance region in the positive bias current-voltage characteristics. A large memory operation window, e.g., 0.72 V, with a long charge retention time, e.g., > 10,000 s, was achieved under the proper gate stress voltages. It is a viable dielectric for future nano-size metal oxide semiconductor field effect transistors and capacitors.
机译:已经制备并表征了包含纳米晶硅嵌入Zr掺杂的HfO_2高k电介质膜的存储器件,该存储器件具有优于常规非掺杂的高k膜的许多优点。记忆效应由大的逆时针电容-电压滞后(例如2.98 V)和正偏置电流-电压特性中的负差分电阻区域体现。在适当的栅极应力电压下,获得了较大的存储器操作窗口(例如0.72 V)和较长的电荷保持时间(例如> 10,000 s)。它是未来纳米级金属氧化物半导体场效应晶体管和电容器的可行电介质。

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