首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Present Status and Future Prospect of Widegap Semiconductor High-Power Devices
【24h】

Present Status and Future Prospect of Widegap Semiconductor High-Power Devices

机译:宽带隙半导体大功率器件的现状与未来展望

获取原文
获取原文并翻译 | 示例

摘要

High-power device technology is a key technological factor for wireless communication, which is one of the information network infrastructures in the 21st century, as well as power electronics innovation, which contributes considerably to solving the energy saving problem in the future energy network. Widegap semiconductors, such as SiC and GaN, are strongly expected as high-power high-frequency devices and high-power switching devices owing to their material properties. In this paper, the present status and future prospect of these widegap semiconductor high-power devices are reviewed, in the context of applications in wireless communication and power electronics.
机译:高功率设备技术是无线通信的关键技术因素,而无线通信是21世纪的信息网络基础设施之一,而电力电子技术的创新也为解决未来能源网络中的节能问题做出了巨大贡献。由于其材料特性,人们强烈期望将诸如SiC和GaN的宽间隙半导体用作高功率高频器件和高功率开关器件。本文在无线通信和电力电子领域的应用背景下,回顾了这些宽禁带半导体大功率器件的现状和未来展望。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号