首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Micromolding of Three-Dimensional Metal Structures by Electroless Plating of Photopolymerized Resin
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Micromolding of Three-Dimensional Metal Structures by Electroless Plating of Photopolymerized Resin

机译:通过化学镀光聚合树脂对三维金属结构进行微成型

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A novel microfabrication process for three-dimensional metal microstructures was proposed. The process consists of four steps: the fabrication of a resin mold by photopolymerization, the electroless plating of the mold, the electrolytic grinding to expose a metal inside the mold, and the extraction of the structure. We experimentally demonstrated the molding process. The epoxy resin suitable for polymerization via a two-photon absorption reaction was successfully plated using a nickel metal. The lattice distortion of the plated metal was found to be reduced by decreasing the pH of plate solution, which was revealed by X-ray diffraction measurement. We replicated the shape of a rice grain with nickel by immersing the plated polymer mold in acetone for extraction. X-ray fluorescence measurements indicated the high purity of the nickel replica.
机译:提出了一种新颖的三维金属微结构的微细加工工艺。该过程包括四个步骤:通过光聚合来制造树脂模具,对模具进行化学镀,对模具内的金属进行电解研磨以露出结构以及提取结构。我们通过实验证明了成型过程。使用镍金属成功地电镀了适合于通过双光子吸收反应聚合的环氧树脂。发现通过降低板溶液的pH可以降低镀覆金属的晶格畸变,这通过X射线衍射测量表明。通过将电镀的聚合物模具浸入丙酮中进行萃取,我们用镍复制了米粒的形状。 X射线荧光测量表明镍复制品的高纯度。

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