首页> 外国专利> CATALYST FILLER FOR ELECTROLESS METAL PLATING, RESIN COMPOSITION FOR ELECTROLESS METAL PLATING AND COMPOSITE FORMED ARTICLE

CATALYST FILLER FOR ELECTROLESS METAL PLATING, RESIN COMPOSITION FOR ELECTROLESS METAL PLATING AND COMPOSITE FORMED ARTICLE

机译:化学镀金属的催化剂填料,化学镀金属的树脂组合物和复合材料制品

摘要

PURPOSE: To provide a new catalytic filler for electroless metal plating capable of drastically shortening the depositing time of an electroless metal, especially copper, a resin composition for electroless metal plating and a composite formed article. ;CONSTITUTION: A ruthenium compd. and a palladium compd. are adsorbed on the surface of a finely crushed filler and then brought into contact with hydrogen or a reducing agent to impart catalysis for the electroless metal plating deposition to the ruthenium compd. and palladium compd., and a catalystic filler for electroless metal plating is obtained. The filler is mixed in a base resin to form a resin composition for electroless metal plating. The formed article 12 of the resin composition for electroless metal plating and a noncatalytic resin 14 are integrally formed and applied with electroless plating to obtain a composite formed article 10.;COPYRIGHT: (C)1996,JPO
机译:用途:提供一种新的用于化学镀金属的催化填料,其能够大大缩短化学镀金属,特别是铜的沉积时间,一种化学镀金属的树脂组合物和复合成型制品。 ;组成:钌。和钯化合物。将其吸附在细碎的填料表面上,然后使其与氢或还原剂接触,以催化对所合成的钌进行化学镀。与钯复合,得到用于化学镀的催化剂填料。将填料混合在基础树脂中以形成用于化学镀的树脂组合物。将用于化学镀金属的树脂组合物的成型体12和非催化树脂14一体成型并施以化学镀,以获得复合成型体10。版权所有:(C)1996,JPO

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